Developement of automation technology by Supertronic

The project “Developement of automation technology” is an initiative led by Supertronic with the participation of TECNIO inLab FIB center, focused on the automation of the selection and creation process of plastic envelopes for printed circuit boards (PCB’s).

This project focuses on the use of advanced computer vision techniques and Deep Learning algorithms for image recognition of printed circuits, with the aim of detecting their relevant dimensions and mechatronic components and creating detailed 3D models automatically. Once the 3D model of the printed circuit board has been generated, it will be compared with databases of pre-existing boxes – also in 3D – to find the ones that best fit the circuit design and determine the optimal position of the holes (to be done by CNC milling) necessary for their assembly and correct operation. In cases where no standard box is suitable, the design of a custom box that meets the specific needs of the printed circuit and optimal coverage is carried out. This process includes the creation of CAD models for the manufacture of a tailor-made box that guarantees the safety, functionality and efficiency of the assembly of the circuit. Later, this 3D model could be used for the manufacture of a plastic injection mold.